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WF2M16W-150DAQ5

Microsemi Corporation

Microsemi Corporation WF2M16W-150DAQ5
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • JESD-30 Code
    R-CDSO-G56
  • Memory Width
    16
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e4
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    GOLD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Additional Feature
    USER CONFIGURABLE AS 2 X 2M X 8
  • Memory Organization
    2MX16
  • Number of Functions
    1
  • Number of Terminals
    56
  • Access Time-Max (ns)
    150
  • Number of Words Code
    2M
  • Memory Density (bits)
    33554432
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Alternate Memory Width
    8
  • Seated Height-Max (mm)
    4.08
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    2097152
  • Programming Voltage (V)
    5
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883

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WF2M16W-150DAQ5