ProductsManufacturers
Events
Send an RFQBOM Tool

WEDPZ512K72V-133BI

MERCURY SYSTEMS INC

MERCURY SYSTEMS INC WEDPZ512K72V-133BI
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B152
  • Memory Width
    72
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    PIPELINED ARCHITECTURE
  • Memory Organization
    512KX72
  • Number of Functions
    1
  • Number of Terminals
    152
  • Access Time-Max (ns)
    4.2
  • Number of Words Code
    512K
  • Memory Density (bits)
    37748736
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    524288
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

0 suppliers available to buy or to bid for WEDPZ512K72V-133BI

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
WEDPZ512K72V-133BI
Send an RFQ
WEDPZ512K72V-133BI