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WEDMC64603RV266BM

Microsemi Corporation

Microsemi Corporation WEDMC64603RV266BM
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    21
  • Length (mm)
    21
  • Speed (MHz)
    266
  • JESD-30 Code
    S-CBGA-B255
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Integrated Cache
    NO
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Additional Feature
    IC ALSO REQUIRES PLL SUPPLY VOLTAGE OF 2.375V TO 2.625V AND I/O SUPPLY VOLTAGE OF 3.135V TO 3.465V
  • Number of Terminals
    255
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    3
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • External Data Bus Width
    32
  • Clock Frequency-Max (MHz)
    266
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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WEDMC64603RV266BM