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WED3C755E8MC-350BH9I

Microsemi Corporation

Microsemi Corporation WED3C755E8MC-350BH9I
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Format
    FIXED POINT
  • Technology
    CMOS
  • Width (mm)
    21.21
  • Length (mm)
    25.25
  • Speed (MHz)
    350
  • JESD-30 Code
    R-CBGA-B255
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    LG-MAX;WD-MAX;SEATED HT-CALCULATED
  • Number of Terminals
    255
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    3.262
  • Supply Voltage-Max (V)
    2.1
  • Supply Voltage-Min (V)
    1.9
  • Supply Voltage-Nom (V)
    2
  • External Data Bus Width
    64
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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WED3C755E8MC-350BH9I
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WED3C755E8MC-350BH9I