W97BH6LBQX2I by Winbond Electronics Corporation | Sourcengine

Winbond Electronics Corporation W97BH6LBQX2I

Lifecycle status
Active
REACH
REACH compliant
Description
DDR2 DRAM, 128MX16, CMOS, PBGA168
Category
Semiconductors Memory ICs DRAMs DDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
12
Access Mode
MULTI BANK PAGE BURST
Length (mm)
12
JESD-30 Code
S-PBGA-B168
Memory Width
16
Package Code
VFBGA
Self Refresh
YES
Package Shape
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR2 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
Memory Organization
128MX16
Number of Functions
1
Number of Terminals
168
Terminal Pitch (mm)
0.5
Number of Words Code
128M
Memory Density (bits)
2147483648
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
0.8
Supply Voltage-Max (V)
1.3
Supply Voltage-Min (V)
1.14
Supply Voltage-Nom (V)
1.2
Number of Words (words)
134217728
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40