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W97AH6KBQX1E

Winbond Electronics Corporation

Winbond Electronics Corporation W97AH6KBQX1E
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Width
    12 mm
  • Length
    12 mm
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    S-PBGA-B168
  • Memory Width
    16
  • Organization
    64MX16
  • Package Code
    VFBGA
  • Self Refresh
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    1073741824 bit
  • Memory IC Type
    LPDDR2 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Number of Ports
    1
  • Number of Words
    67108864 words
  • Seated Height-Max
    0.8 mm
  • Terminal Position
    BOTTOM
  • Additional Feature
    SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
  • Number of Functions
    1
  • Number of Terminals
    168
  • Number of Words Code
    64M
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (Vsup)
    1.3 V
  • Supply Voltage-Min (Vsup)
    1.14 V
  • Supply Voltage-Nom (Vsup)
    1.2 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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