W979H6KBQX1E by Winbond Electronics Corporation | Sourcengine

Winbond Electronics Corporation W979H6KBQX1E

Lifecycle status
Active
RoHS
RoHS compliant
REACH
REACH compliant
Description
LPDDR2 DRAM, 32MX16, CMOS, PBGA168
Category
Semiconductors Memory ICs DRAMs LPDDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.28
SB Code
8542.32.00.15

Technology
CMOS
Width (mm)
12
Access Mode
FOUR BANK PAGE BURST
Length (mm)
12
JESD-30 Code
S-PBGA-B168
Memory Width
16
Package Code
VFBGA
Self Refresh
YES
Package Shape
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
LPDDR2 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
Memory Organization
32MX16
Number of Functions
1
Number of Terminals
168
Terminal Pitch (mm)
0.5
Number of Words Code
32M
Memory Density (bits)
536870912
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
0.8
Supply Voltage-Max (V)
1.3
Supply Voltage-Min (V)
1.14
Supply Voltage-Nom (V)
1.2
Number of Words (words)
33554432
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED