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W963L6ABN70E

Winbond Electronics Corporation

Winbond Electronics Corporation W963L6ABN70E
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B48
  • Memory Width
    16
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Memory IC Type
    PSEUDO STATIC RAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY
  • Memory Organization
    512KX16
  • Number of Functions
    1
  • Number of Terminals
    48
  • Terminal Pitch (mm)
    0.75
  • Access Time-Max (ns)
    65
  • Number of Words Code
    512K
  • Memory Density (bits)
    8388608
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Max (V)
    2.7
  • Supply Voltage-Min (V)
    2.3
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    524288
  • Standby Current-Max (A)
    7.0E-5
  • Supply Current-Max (mA)
    20
  • Package Equivalence Code
    BGA48,6X8,30
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25

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W963L6ABN70E