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W82M32V-12BC

Microsemi Corporation

Microsemi Corporation W82M32V-12BC
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B255
  • Memory Width
    32
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    USER CONFIGURABLE AS 4MX 16 OR 8M X 8
  • Memory Organization
    2MX32
  • Number of Functions
    1
  • Number of Terminals
    255
  • Access Time-Max (ns)
    12
  • Number of Words Code
    2M
  • Memory Density (bits)
    67108864
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    2097152
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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W82M32V-12BC
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W82M32V-12BC