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W78M64VP110SBC

Microsemi Corporation

Microsemi Corporation W78M64VP110SBC
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    13.1
  • Length (mm)
    22.1
  • JESD-30 Code
    R-PBGA-B159
  • Memory Width
    64
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO CONFIGURED AS 32M X 16; LG-MAX; WD-MAX; SEATED HT-CALCULATED
  • Memory Organization
    8MX64
  • Number of Functions
    1
  • Number of Terminals
    159
  • Terminal Pitch (mm)
    1.27
  • Number of Words Code
    8M
  • Memory Density (bits)
    536870912
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    32
  • Seated Height-Max (mm)
    3.31
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    8388608
  • Programming Voltage (V)
    3.3
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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W78M64VP110SBC
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W78M64VP110SBC