ProductsManufacturers
Events
Send an RFQBOM Tool

W78M32VP110BI

Microsemi Corporation

Microsemi Corporation W78M32VP110BI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Data Polling
    YES
  • JESD-30 Code
    R-PBGA-B159
  • Memory Width
    32
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Write Protection
    HARDWARE/SOFTWARE
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    8
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    8MX32
  • Number of Functions
    1
  • Number of Terminals
    159
  • Sector Size (words)
    64K
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    110
  • Number of Words Code
    8M
  • Memory Density (bits)
    268435456
  • Package Body Material
    PLASTIC/EPOXY
  • Number of Sectors/Size
    128
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    8388608
  • Programming Voltage (V)
    3.3
  • Standby Current-Max (A)
    2.0E-5
  • Supply Current-Max (mA)
    360
  • Package Equivalence Code
    BGA159,10X16,50
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

0 suppliers available to buy or to bid for W78M32VP110BI

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
W78M32VP110BI
Send an RFQ
W78M32VP110BI