ProductsManufacturers
Events
Send an RFQBOM Tool

W741L260

Winbond Electronics Corporation

Winbond Electronics Corporation W741L260
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Bit Size
    4
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    20
  • Speed (MHz)
    1
  • ADC Channels
    NO
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    R-PQFP-G80
  • PWM Channels
    NO
  • Package Code
    QFP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Number of I/O Lines
    21
  • Number of Terminals
    80
  • Program Memory Type
    MROM
  • Terminal Pitch (mm)
    0.8
  • Data RAM Size (bytes)
    64
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.3
  • Supply Voltage-Max (V)
    1.8
  • Supply Voltage-Min (V)
    1.5
  • Supply Voltage-Nom (V)
    1.5
  • External Data Bus Width
    0
  • Supply Current-Max (mA)
    0.4
  • Package Equivalence Code
    QFP80,.75X1,32
  • Clock Frequency-Max (MHz)
    1
  • Program Memory Size (words)
    2048
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for W741L260

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
W741L260
Send an RFQ
W741L260