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W72M64VB70BI

Microsemi Corporation

Microsemi Corporation W72M64VB70BI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Data Polling
    YES
  • JESD-30 Code
    R-PBGA-B159
  • Memory Width
    64
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Parallel/Serial
    PARALLEL
  • Write Protection
    HARDWARE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    2MX64
  • Number of Terminals
    159
  • Sector Size (words)
    4K,32K
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    70
  • Number of Words Code
    2M
  • Memory Density (bits)
    134217728
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    NO
  • Number of Sectors/Size
    8,64
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    2097152
  • Standby Current-Max (A)
    2.1E-5
  • Supply Current-Max (mA)
    140
  • Package Equivalence Code
    BGA159,10X16,50
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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W72M64VB70BI
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W72M64VB70BI