ProductsManufacturers
Events
Send an RFQBOM Tool

W66BL6NBUAGI

Winbond Electronics Corporation

Winbond Electronics Corporation W66BL6NBUAGI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    10
  • Access Mode
    MULTI BANK PAGE BURST
  • Length (mm)
    14.5
  • JESD-30 Code
    R-PBGA-B200
  • Memory Width
    16
  • Package Code
    VFBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    LPDDR4 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH, IT ALSO REQUIRES 1.8V NOMINAL SUPPLY VOLTAGE
  • Memory Organization
    128MX16
  • Number of Functions
    1
  • Number of Terminals
    200
  • Terminal Pitch (mm)
    0.8
  • Number of Words Code
    128M
  • Memory Density (bits)
    2147483648
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.8
  • Supply Voltage-Max (V)
    1.17
  • Supply Voltage-Min (V)
    1.06
  • Supply Voltage-Nom (V)
    1.1
  • Number of Words (words)
    134217728
  • Sequential Burst Length
    16,32
  • Interleaved Burst Length
    16,32
  • Package Equivalence Code
    BGA200,12X20,32/25
  • Clock Frequency-Max (MHz)
    1869.1
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    95
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

0 suppliers available to buy or to bid for W66BL6NBUAGI

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
W66BL6NBUAGI
Send an RFQ
W66BL6NBUAGI