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W641GG2JB-14

Winbond Electronics Corporation

W641GG2JB-14 Datasheet
Winbond Electronics Corporation W641GG2JB-14
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Width
    10 mm
  • Length
    14 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    FOUR BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B136
  • Memory Width
    1
  • Organization
    1GX1
  • Package Code
    TFBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    1073741824 bit
  • Memory IC Type
    SYNCHRONOUS GRAPHICS RAM
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    8192
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    0.25 ns
  • Number of Ports
    1
  • Number of Words
    1073741824 words
  • Seated Height-Max
    1.2 mm
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH
  • Number of Functions
    1
  • Number of Terminals
    136
  • Number of Words Code
    1G
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    4,8
  • Package Equivalence Code
    BGA136,12X17,32
  • Supply Voltage-Max (Vsup)
    1.9 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Clock Frequency-Max (fCLK)
    700 MHz
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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