ProductsManufacturers
Events
Send an RFQBOM Tool

W55M08

Winbond Electronics Corporation

Winbond Electronics Corporation W55M08
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Memory Width
    1
  • Organization
    8MX1
  • Memory Density
    8388608 bit
  • Memory IC Type
    MASK ROM
  • Number of Words
    8388608 words
  • Temperature Grade
    COMMERCIAL
  • Supply Current-Max
    2 mA
  • Standby Current-Max
    1.0E-6 Amp
  • Number of Words Code
    8M
  • Qualification Status
    Not Qualified
  • Package Equivalence Code
    DIE OR CHIP
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    4.5 V

0 suppliers available to buy or to bid for W55M08

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
W55M08
Send an RFQ
W55M08