W3J512M72G-1333LBM by Microsemi Corporation | Sourcengine

Microsemi Corporation W3J512M72G-1333LBM

Lifecycle status
Transferred
REACH
REACH compliant
Description
DDR3 DRAM, 512MX72, 0.255ns, CMOS, PBGA543
Category
Semiconductors Memory ICs DRAMs DDR3 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Width (mm)
23.1
Access Mode
SINGLE BANK PAGE BURST
Length (mm)
32.1
JESD-30 Code
R-PBGA-B543
Memory Width
72
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3 DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
Memory Organization
512MX72
Number of Functions
1
Number of Terminals
543
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.255
Number of Words Code
512M
Memory Density (bits)
38654705664
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
3
Supply Voltage-Max (V)
1.575
Supply Voltage-Min (V)
1.425
Supply Voltage-Nom (V)
1.5
Number of Words (words)
536870912
Standby Current-Max (A)
0.162
Supply Current-Max (mA)
1980
Package Equivalence Code
BGA543,21X26,40
Clock Frequency-Max (MHz)
667
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55