W3J512M40KT-1333B3C by Microsemi Corporation | Sourcengine

Microsemi Corporation W3J512M40KT-1333B3C

Lifecycle status
Transferred
REACH
REACH compliant
Description
DDR3L DRAM, 512MX40, CMOS, PBGA204
Category
Semiconductors Memory ICs DRAMs DDR3L DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
10.1
Access Mode
SINGLE BANK PAGE BURST
Length (mm)
14.6
JESD-30 Code
R-PBGA-B204
Memory Width
40
Package Code
FBGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3L DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
Memory Organization
512MX40
Number of Functions
1
Number of Terminals
204
Terminal Pitch (mm)
0.8
Number of Words Code
512M
Memory Density (bits)
21474836480
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
4.1
Supply Voltage-Max (V)
1.45
Supply Voltage-Min (V)
1.283
Supply Voltage-Nom (V)
1.35
Number of Words (words)
536870912
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0