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W3J512M32K-XHDX

Microsemi Corporation

W3J512M32K-XHDX Datasheet
Microsemi Corporation W3J512M32K-XHDX
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Technology
    CMOS
  • Width (mm)
    10
  • Access Mode
    SINGLE BANK PAGE BURST
  • Length (mm)
    14
  • JESD-30 Code
    R-PBGA-B168
  • Memory Width
    32
  • Package Code
    BGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    DDR3L DRAM
  • Operating Mode
    ASYNCHRONOUS
  • Number of Ports
    1
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY
  • Memory Organization
    512MX32
  • Number of Functions
    1
  • Number of Terminals
    168
  • Number of Words Code
    512M
  • Memory Density (bits)
    17179869184
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    1.35
  • Number of Words (words)
    536870912

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W3J512M32K-XHDX