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W3HG2128M72EEU665PD4IG

Microsemi Corporation

Microsemi Corporation W3HG2128M72EEU665PD4IG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PDMA-N200
  • Memory Width
    72
  • Package Code
    DIMM
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory IC Type
    DDR DRAM MODULE
  • Refresh Cycles
    8192
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    256MX72
  • Number of Terminals
    200
  • Terminal Pitch (mm)
    0.6
  • Access Time-Max (ns)
    0.45
  • Number of Words Code
    256M
  • Memory Density (bits)
    19327352832
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Number of Words (words)
    268435456
  • Standby Current-Max (A)
    0.126
  • Supply Current-Max (mA)
    3870
  • Package Equivalence Code
    DIMM200,24
  • Clock Frequency-Max (MHz)
    333
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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W3HG2128M72EEU665PD4IG