W3H64M72E-533SBI by WHITE ELECTRONIC DESIGNS CORP | Sourcengine

WHITE ELECTRONIC DESIGNS CORP W3H64M72E-533SBI

Lifecycle status
Transferred
Description
DDR2 DRAM, 64MX72, 0.5ns, CMOS, PBGA208
Category
Semiconductors Memory ICs DRAMs DDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Width (mm)
16
Access Mode
MULTI BANK PAGE BURST
Length (mm)
22
JESD-30 Code
R-PBGA-B208
Memory Width
72
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
DDR2 DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH
Memory Organization
64MX72
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.5
Number of Words Code
64M
Memory Density (bits)
4831838208
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
3.64
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
67108864
Supply Current-Max (mA)
1750
Package Equivalence Code
BGA208,11X19,40
Clock Frequency-Max (MHz)
267
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED