W3H64M72E-400BI by Microsemi Corporation | Sourcengine

Microsemi Corporation W3H64M72E-400BI

Lifecycle status
Transferred
Description
DDR2 DRAM, 64MX72, 0.8ns, CMOS, PBGA208
Category
Semiconductors Memory ICs DRAMs DDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Width (mm)
16.1
Access Mode
FOUR BANK PAGE BURST
Length (mm)
20.1
JESD-30 Code
R-PBGA-B208
Memory Width
72
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR2 DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
Memory Organization
64MX72
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.8
Number of Words Code
64M
Memory Density (bits)
4831838208
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
2.83
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
67108864
Supply Current-Max (mA)
1420
Package Equivalence Code
BGA208,11X19,40
Clock Frequency-Max (MHz)
200
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40