W3H32M64E-667SBM by WHITE ELECTRONIC DESIGNS CORP | Sourcengine

WHITE ELECTRONIC DESIGNS CORP W3H32M64E-667SBM

Lifecycle status
Transferred
Description
DDR2 DRAM, 32MX64, 0.65ns, CMOS, PBGA208
Category
Semiconductors Memory ICs DRAMs DDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Access Mode
FOUR BANK PAGE BURST
JESD-30 Code
R-PBGA-B208
Memory Width
64
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR2 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH
Memory Organization
32MX64
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.65
Number of Words Code
32M
Memory Density (bits)
2147483648
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.06
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
33554432
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED