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W3H264M16E-533SBM

Microsemi Corporation

Microsemi Corporation W3H264M16E-533SBM
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Width
    11.1 mm
  • Length
    14.1 mm
  • Technology
    CMOS
  • Access Mode
    DUAL BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B79
  • Memory Width
    16
  • Organization
    128MX16
  • Package Code
    BGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    2147483648 bit
  • Memory IC Type
    DDR2 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    0.65 ns
  • Number of Ports
    1
  • Number of Words
    134217728 words
  • Seated Height-Max
    2.87 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
  • Number of Functions
    1
  • Number of Terminals
    79
  • Number of Words Code
    128M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    1.9 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V

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W3H264M16E-533SBM