W3H128M72ER-667NBI by Microsemi Corporation | Sourcengine

Microsemi Corporation W3H128M72ER-667NBI

Lifecycle status
Transferred
REACH
REACH compliant
Description
DDR2 DRAM, 128MX72, 0.45ns, CMOS, PBGA255
Category
Semiconductors Memory ICs DRAMs DDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
21.15
Access Mode
MULTI BANK PAGE BURST
Length (mm)
23.15
JESD-30 Code
R-PBGA-B255
Memory Width
72
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR2 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
Memory Organization
128MX72
Number of Functions
1
Number of Terminals
255
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
0.45
Number of Words Code
128M
Memory Density (bits)
9663676416
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.556
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
134217728
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40