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W3EG6466S265BD4MG

Microsemi Corporation

Microsemi Corporation W3EG6466S265BD4MG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Technology
    CMOS
  • Access Mode
    DUAL BANK PAGE BURST
  • JESD-30 Code
    R-XDMA-N200
  • Memory Width
    64
  • Organization
    64MX64
  • Package Code
    DIMM
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    4294967296 bit
  • Memory IC Type
    DDR DRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Access Time-Max
    0.75 ns
  • Number of Ports
    1
  • Number of Words
    67108864 words
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Additional Feature
    AUTO/SELF REFRESH
  • Number of Functions
    1
  • Number of Terminals
    200
  • Number of Words Code
    64M
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    2.7 V
  • Supply Voltage-Min (Vsup)
    2.3 V
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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W3EG6466S265BD4MG