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W3E64M16S-200SBI

MERCURY SYSTEMS INC

MERCURY SYSTEMS INC W3E64M16S-200SBI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Width
    10 mm
  • Length
    12.5 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    FOUR BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B60
  • Memory Width
    16
  • Organization
    64MX16
  • Package Code
    BGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    1073741824 bit
  • Memory IC Type
    DDR1 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Number of Ports
    1
  • Number of Words
    67108864 words
  • Seated Height-Max
    2.88 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH
  • Number of Functions
    1
  • Number of Terminals
    60
  • Number of Words Code
    64M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Sequential Burst Length
    2,4,8
  • Interleaved Burst Length
    2,4,8
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    2.7 V
  • Supply Voltage-Min (Vsup)
    2.3 V
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Clock Frequency-Max (fCLK)
    200 MHz
  • Peak Reflow Temperature (Cel)
    240
  • Time@Peak Reflow Temperature-Max (s)
    30

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W3E64M16S-200SBI