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W3E64M16S-200BC

Microsemi Corporation

Microsemi Corporation W3E64M16S-200BC
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Technology
    CMOS
  • Width (mm)
    10.1
  • Access Mode
    FOUR BANK PAGE BURST
  • Length (mm)
    12.6
  • JESD-30 Code
    R-PBGA-B60
  • Memory Width
    16
  • Package Code
    FBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    DDR1 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
  • Memory Organization
    64MX16
  • Number of Functions
    1
  • Number of Terminals
    60
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    0.8
  • Number of Words Code
    64M
  • Memory Density (bits)
    1073741824
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.31
  • Supply Voltage-Max (V)
    2.7
  • Supply Voltage-Min (V)
    2.3
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    67108864
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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W3E64M16S-200BC