W3E32M72S-250SBM by WHITE ELECTRONIC DESIGNS CORP | Sourcengine

WHITE ELECTRONIC DESIGNS CORP W3E32M72S-250SBM

Lifecycle status
Transferred
Description
DDR1 DRAM, 32MX72, 0.8ns, CMOS, PBGA208
Category
Semiconductors Memory ICs DRAMs DDR1 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Access Mode
FOUR BANK PAGE BURST
JESD-30 Code
R-PBGA-B208
Memory Width
72
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
DDR1 DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Additional Feature
AUTO REFRESH
Memory Organization
32MX72
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.8
Number of Words Code
32M
Memory Density (bits)
2415919104
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
3.06
Supply Voltage-Max (V)
2.7
Supply Voltage-Min (V)
2.3
Supply Voltage-Nom (V)
2.5
Number of Words (words)
33554432
Standby Current-Max (A)
0.025
Supply Current-Max (mA)
2000
Package Equivalence Code
BGA208,11X19,40
Clock Frequency-Max (MHz)
125
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55