W3E32M64SA-266B2M by MERCURY SYSTEMS INC | Sourcengine

MERCURY SYSTEMS INC W3E32M64SA-266B2M

Lifecycle status
Active
REACH
REACH compliant
Description
DDR1 DRAM, 32MX64, 0.75ns, CMOS, PBGA219
Category
Semiconductors Memory ICs DRAMs DDR1 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
21.1
Access Mode
FOUR BANK PAGE BURST
Length (mm)
21.1
JESD-30 Code
S-PBGA-B219
Memory Width
64
Package Code
BGA
Self Refresh
YES
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR1 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
Memory Organization
32MX64
Number of Functions
1
Number of Terminals
219
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
0.75
Number of Words Code
32M
Memory Density (bits)
2147483648
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.69
Supply Voltage-Max (V)
2.7
Supply Voltage-Min (V)
2.3
Supply Voltage-Nom (V)
2.5
Number of Words (words)
33554432
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55