ProductsManufacturers
Events
Send an RFQBOM Tool

W27L01P-70

Winbond Electronics Corporation

Winbond Electronics Corporation W27L01P-70
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Width (mm)
    11.43
  • Length (mm)
    13.97
  • Data Polling
    NO
  • JESD-30 Code
    R-PQCC-N32
  • Memory Width
    8
  • Package Code
    QCCN
  • Package Shape
    RECTANGULAR
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory IC Type
    EEPROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Memory Organization
    128KX8
  • Number of Functions
    1
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    70
  • Number of Words Code
    128K
  • Memory Density (bits)
    1048576
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    NO
  • Seated Height-Max (mm)
    3.56
  • Supply Voltage-Max (V)
    3.63
  • Supply Voltage-Min (V)
    2.97
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    131072
  • Programming Voltage (V)
    12
  • Standby Current-Max (A)
    2.0E-5
  • Supply Current-Max (mA)
    30
  • Package Equivalence Code
    LDCC32,.5X.6
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for W27L01P-70

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
W27L01P-70
Send an RFQ
W27L01P-70