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W25Q64FWXGIG

Winbond Electronics Corporation

Winbond Electronics Corporation W25Q64FWXGIG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    4
  • Length (mm)
    4
  • JESD-30 Code
    R-PDSO-N8
  • Memory Width
    8
  • Package Code
    HVSON
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    8MX8
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.8
  • Number of Words Code
    8M
  • Memory Density (bits)
    67108864
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    0.5
  • Supply Voltage-Max (V)
    1.95
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    1.8
  • Number of Words (words)
    8388608
  • Programming Voltage (V)
    1.8
  • Clock Frequency-Max (MHz)
    104
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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W25Q64FWXGIG