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W25Q40BLSVIP

Winbond Electronics Corporation

Winbond Electronics Corporation W25Q40BLSVIP
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    3.9
  • Length (mm)
    4.9
  • JESD-30 Code
    R-PDSO-G8
  • Memory Width
    8
  • Package Code
    VSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    512KX8
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    1.27
  • Number of Words Code
    512K
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.3
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    524288
  • Programming Voltage (V)
    3
  • Clock Frequency-Max (MHz)
    80
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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W25Q40BLSVIP