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W25Q16JVBYJQ

Winbond Electronics Corporation

Winbond Electronics Corporation W25Q16JVBYJQ
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • Width (mm)
    1.457
  • Length (mm)
    1.803
  • JESD-30 Code
    R-PBGA-B8
  • Memory Width
    8
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    QSPI
  • Write Protection
    HARDWARE/SOFTWARE
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    2MX8
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.4
  • Number of Words Code
    2M
  • Memory Density (bits)
    16777216
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    1
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    0.476
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • Data Retention Time-Min
    20
  • Number of Words (words)
    2097152
  • Programming Voltage (V)
    3
  • Standby Current-Max (A)
    1.5E-5
  • Supply Current-Max (mA)
    20
  • Package Equivalence Code
    BGA8,2X4,16
  • Clock Frequency-Max (MHz)
    133
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40

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