ProductsManufacturers
Events
Send an RFQBOM Tool

W25N01JWSFJT

Winbond Electronics Corporation

Winbond Electronics Corporation W25N01JWSFJT
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Technology
    CMOS
  • Width (mm)
    7.49
  • Length (mm)
    10.31
  • JESD-30 Code
    R-PDSO-G16
  • Memory Width
    8
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    QSPI
  • Write Protection
    HARDWARE/SOFTWARE
  • Terminal Position
    DUAL
  • Memory Organization
    128MX8
  • Number of Functions
    1
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    1.27
  • Number of Words Code
    128M
  • Memory Density (bits)
    1073741824
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    2.64
  • Supply Voltage-Max (V)
    1.95
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Data Retention Time-Min
    10
  • Number of Words (words)
    134217728
  • Programming Voltage (V)
    1.8
  • Standby Current-Max (A)
    0.0004
  • Supply Current-Max (mA)
    35
  • Package Equivalence Code
    SOP16,.4
  • Clock Frequency-Max (MHz)
    166
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for W25N01JWSFJT

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
W25N01JWSFJT
Send an RFQ
W25N01JWSFJT