W25N01GWSFIG by Winbond Electronics Corporation | Sourcengine

Winbond Electronics Corporation W25N01GWSFIG

Lifecycle status
Active
RoHS
RoHS compliant
REACH
REACH compliant
Description
Flash, 128MX8, PDSO16
Category
Semiconductors Memory ICs Flash Memories FLASH

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
SLC NAND TYPE
Technology
CMOS
Width (mm)
7.49
Length (mm)
10.31
JESD-30 Code
R-PDSO-G16
Memory Width
8
Package Code
SOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
FLASH
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Serial Bus Type
QSPI
Temperature Grade
INDUSTRIAL
Terminal Position
DUAL
Memory Organization
128MX8
Number of Functions
1
Number of Terminals
16
Terminal Pitch (mm)
1.27
Number of Words Code
128M
Memory Density (bits)
1024458752
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
2.64
Supply Voltage-Max (V)
1.95
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
128057344
Programming Voltage (V)
1.8
Package Equivalence Code
SOP8,.3
Clock Frequency-Max (MHz)
104
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED