Microsemi Corporation VSC850-QG
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    28
  • Length (mm)
    28
  • JESD-30 Code
    S-PQFP-G208
  • Package Code
    HFQFP
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, HEAT SINK/SLUG, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Low Power Mode
    NO
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Number of Terminals
    208
  • Terminal Pitch (mm)
    0.5
  • Output Data Bus Width
    32
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.07
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    16
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, CROSSBAR SWITCH
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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VSC850-QG