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VE29G01FAM

Microsemi Corporation

VE29G01FAM Datasheet
Microsemi Corporation VE29G01FAM
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    GAAS
  • JESD-30 Code
    S-CQFP-F52
  • Package Code
    QFF
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Number of Terminals
    52
  • Terminal Pitch (mm)
    1
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Package Equivalence Code
    QFL52,.55SQ,40
  • uPs/uCs/Peripheral ICs Type
    BIT-SLICE MICROPROCESSOR
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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VE29G01FAM