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V73CBG08168RCLMI9H

PROMOS TECHNOLOGIES INC

PROMOS TECHNOLOGIES INC V73CBG08168RCLMI9H
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B96
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    8589934592 bit
  • Memory IC Type
    DDR3L DRAM
  • Refresh Cycles
    8192
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    0.255 ns
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    378 mA
  • Number of Terminals
    96
  • Standby Current-Max
    0.024 Amp
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    8
  • Interleaved Burst Length
    8
  • Package Equivalence Code
    BGA96,9X16,32
  • Operating Temperature-Max
    105 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    1.35 V
  • Clock Frequency-Max (fCLK)
    667 MHz

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V73CBG08168RCLMI9H