V73CBG02808RCLJI9E by PROMOS TECHNOLOGIES INC | Sourcengine

PROMOS TECHNOLOGIES INC V73CBG02808RCLJI9E

Lifecycle status
Active-Unconfirmed
RoHS
RoHS compliant
REACH
REACH compliant
Description
DDR3L DRAM, 256MX8, 0.255ns, CMOS, PBGA78
Category
Semiconductors Memory ICs DRAMs DDR3L DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Width (mm)
8
Length (mm)
10.5
JESD-30 Code
R-PBGA-B78
Memory Width
8
Package Code
FBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3L DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
DLA Qualification
Not Qualified
Temperature Grade
AUTOMOTIVE
Terminal Position
BOTTOM
Memory Organization
256MX8
Number of Functions
1
Number of Terminals
78
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
0.255
Number of Words Code
256M
Memory Density (bits)
2147483648
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
1.45
Supply Voltage-Min (V)
1.283
Supply Voltage-Nom (V)
1.35
Number of Words (words)
268435456
Sequential Burst Length
8
Standby Current-Max (A)
0.012
Supply Current-Max (mA)
220
Interleaved Burst Length
8
Package Equivalence Code
BGA78,9X13,32
Clock Frequency-Max (MHz)
667
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-40