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UXM2864-200/B

SEEQ TECHNOLOGY INC

SEEQ TECHNOLOGY INC UXM2864-200/B
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    NMOS
  • JESD-30 Code
    X-XUUC-N27
  • Memory Width
    8
  • Package Code
    DIE
  • Package Shape
    UNSPECIFIED
  • Package Style
    UNCASED CHIP Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory IC Type
    EEPROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    UPPER
  • Additional Feature
    AUTOMATIC WRITE
  • Memory Organization
    8KX8
  • Number of Functions
    1
  • Number of Terminals
    27
  • Access Time-Max (ns)
    200
  • Number of Words Code
    8K
  • Memory Density (bits)
    65536
  • Package Body Material
    UNSPECIFIED
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    8192
  • Programming Voltage (V)
    5
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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UXM2864-200/B
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UXM2864-200/B