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UT700-CEA

AEROFLEX MICROELECTRONIC SOLUTIONS

AEROFLEX MICROELECTRONIC SOLUTIONS UT700-CEA
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    28.956
  • Length (mm)
    28.956
  • Speed (MHz)
    166
  • JESD-30 Code
    S-CBGA-B484
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Integrated Cache
    YES
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    484
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    4.51
  • Supply Voltage-Max (V)
    1.3
  • Supply Voltage-Min (V)
    1.1
  • Supply Voltage-Nom (V)
    1.2
  • Package Equivalence Code
    BGA484,22X22,50
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -55

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UT700-CEA
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UT700-CEA