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UPD77213F1-XXX-DA2

Renesas Electronics Corp.

Renesas Electronics Corp. UPD77213F1-XXX-DA2
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.35
  • SB Code
    8542.31.00.35
  • Format
    FIXED POINT
  • Bit Size
    16
  • Technology
    CMOS
  • Width (mm)
    10
  • Length (mm)
    10
  • JESD-30 Code
    S-PBGA-B161
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Barrel Shifter
    NO
  • Low Power Mode
    YES
  • Integrated Cache
    NO
  • Number of Timers
    2
  • Address Bus Width
    20
  • Terminal Position
    BOTTOM
  • Number of Terminals
    161
  • Program Memory Type
    MROM
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Number of DMA Channels
    8
  • On Chip Data RAM Width
    16
  • Seated Height-Max (mm)
    1.33
  • Supply Voltage-Max (V)
    1.65
  • Supply Voltage-Min (V)
    1.425
  • Supply Voltage-Nom (V)
    1.5
  • External Data Bus Width
    16
  • Clock Frequency-Max (MHz)
    120
  • Internal Bus Architecture
    SINGLE
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, OTHER
  • Number of External Interrupts
    16
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -20

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UPD77213F1-XXX-DA2
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UPD77213F1-XXX-DA2