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UPD70F3824F1-BA3-A

Renesas Electronics Corp.

Renesas Electronics Corp. UPD70F3824F1-BA3-A
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • CPU Family
    V850
  • Technology
    CMOS
  • Width (mm)
    6
  • Length (mm)
    6
  • Speed (MHz)
    48
  • ADC Channels
    YES
  • DAC Channels
    YES
  • DMA Channels
    YES
  • JESD-30 Code
    S-PBGA-B64
  • PWM Channels
    YES
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of I/O Lines
    45
  • Number of Terminals
    64
  • Program Memory Type
    FLASH
  • Terminal Pitch (mm)
    0.5
  • Data RAM Size (bytes)
    24576
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3
  • External Data Bus Width
    0
  • Supply Current-Max (mA)
    60
  • Package Equivalence Code
    BGA64,8X8,20
  • Clock Frequency-Max (MHz)
    6
  • Program Memory Size (words)
    262144
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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UPD70F3824F1-BA3-A