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UPD48576218F1-E18-DW1-A

Renesas Electronics Corp.

UPD48576218F1-E18-DW1-A Datasheet
Renesas Electronics Corp. UPD48576218F1-E18-DW1-A
  • ECCN
    5A002
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Width
    11
  • Length
    18.5
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B144
  • Memory Width
    18
  • Organization
    32MX18
  • Package Code
    TBGA
  • Self Refresh
    NO
  • JESD-609 Code
    e6
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    603979776 bit
  • Memory IC Type
    SYNCHRONOUS DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Number of Ports
    1
  • Number of Words
    33554432 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN BISMUTH
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO REFRESH, TERM PITCH-MAX
  • Supply Current-Max
    439 mA
  • Number of Functions
    1
  • Number of Terminals
    144
  • Standby Current-Max
    0.25 Amp
  • Number of Words Code
    32M
  • Package Body Material
    PLASTIC/EPOXY
  • Sequential Burst Length
    2,4,8
  • Interleaved Burst Length
    2,4,8
  • Package Equivalence Code
    BGA144,12X18,40/32
  • Operating Temperature-Max
    95 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    1.9 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Clock Frequency-Max (fCLK)
    533 MHz

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UPD48576218F1-E18-DW1-A