ProductsManufacturers
Events
Send an RFQBOM Tool

UPD48288218FF-E25-DW1-A

Renesas Electronics Corp.

UPD48288218FF-E25-DW1-A Datasheet
Renesas Electronics Corp. UPD48288218FF-E25-DW1-A
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.28
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B144
  • Memory Width
    18
  • Organization
    16MX18
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    301989888 bit
  • Memory IC Type
    DDR1 DRAM
  • Terminal Pitch
    0.8 mm
  • Number of Words
    16777216 words
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    970 mA
  • Number of Terminals
    144
  • Number of Words Code
    16M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    2,4,8
  • Package Equivalence Code
    BGA144,12X18,40/32
  • Clock Frequency-Max (fCLK)
    400 MHz

0 suppliers available to buy or to bid for UPD48288218FF-E25-DW1-A

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
UPD48288218FF-E25-DW1-A
Send an RFQ
UPD48288218FF-E25-DW1-A