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UPD48288218AFF-E24-DW1

Renesas Electronics Corp.

UPD48288218AFF-E24-DW1 Datasheet
Renesas Electronics Corp. UPD48288218AFF-E24-DW1
  • ECCN
    5A002
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.28
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B144
  • Memory Width
    18
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    DDR1 DRAM
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Memory Organization
    16MX18
  • Number of Terminals
    144
  • Terminal Pitch (mm)
    0.8
  • Number of Words Code
    16M
  • Memory Density (bits)
    301989888
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Number of Words (words)
    16777216
  • Sequential Burst Length
    2,4,8
  • Package Equivalence Code
    BGA144,12X18,40/32
  • Clock Frequency-Max (MHz)
    400
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Width
    11
  • Length
    18.5

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UPD48288218AFF-E24-DW1