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UPD23C32380F9-XXX-BC3

Renesas Electronics Corp.

Renesas Electronics Corp. UPD23C32380F9-XXX-BC3
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    6 mm
  • Length
    8 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B48
  • Memory Width
    16
  • Organization
    2MX16
  • Package Code
    TFBGA
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    33554432 bit
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    100 ns
  • Number of Words
    2097152 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    1.07 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    55 mA
  • Number of Functions
    1
  • Number of Terminals
    48
  • Standby Current-Max
    3.0E-5 Amp
  • Number of Words Code
    2M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Package Equivalence Code
    BGA48,6X8,32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    -10 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3 V

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UPD23C32380F9-XXX-BC3