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UPD23C16383F9-XXX-BC3

Renesas Electronics Corp.

Renesas Electronics Corp. UPD23C16383F9-XXX-BC3
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B48
  • Memory Width
    16
  • Organization
    1MX16
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    16777216 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    90 ns
  • Number of Words
    1048576 words
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    55 mA
  • Number of Terminals
    48
  • Standby Current-Max
    3.0E-5 Amp
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA48,6X8,32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    -10 Cel

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UPD23C16383F9-XXX-BC3