Microsemi Corporation UMX5601SM
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8541.10.00.80
  • SB Code
    8541.10.00.80
  • Diode Type
    PIN DIODE
  • Technology
    POSITIVE-INTRINSIC-NEGATIVE
  • JESD-30 Code
    O-LELF-R2
  • Configuration
    SINGLE
  • Package Shape
    ROUND
  • Package Style
    LONG FORM Meter
  • Surface Mount
    YES
  • Terminal Form
    WRAP AROUND
  • Case Connection
    ISOLATED
  • DLA Qualification
    Not Qualified
  • Terminal Position
    END
  • Number of Elements
    1
  • Number of Terminals
    2
  • Package Body Material
    GLASS
  • Diode Element Material
    SILICON
  • Reverse Test Voltage (V)
    0
  • Breakdown Voltage-Min (V)
    100
  • Diode Capacitance-Max (pF)
    10
  • Diode Capacitance-Nom (pF)
    9
  • Diode Res Test Current (mA)
    100
  • Diode Res Test Frequency (MHz)
    64
  • Operating Temperature-Max (Cel)
    150
  • Diode Forward Resistance-Max (ohm)
    0.5
  • Minority Carrier Lifetime-Nom (us)
    10

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UMX5601SM